Download PDF by Yan Li,Deepak Goyal: 3D Microelectronic Packaging: From Fundamentals to

By Yan Li,Deepak Goyal

ISBN-10: 3319445847

ISBN-13: 9783319445847

This quantity presents a complete reference for graduate scholars and pros in either academia and at the basics, processing info, and purposes of 3D microelectronic packaging, an development for destiny microelectronic applications. Chapters written through specialists disguise the latest study effects and growth within the following components: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, complicated fabrics, warmth dissipation, thermal administration, thermal mechanical modeling, caliber, reliability, fault isolation, and failure research of 3D microelectronic programs. quite a few pictures, tables, and didactic schematics are integrated all through. This crucial quantity equips readers with an in-depth realizing of all features of 3D packaging, together with packaging structure, processing, thermal mechanical and moisture similar reliability matters, universal disasters, constructing components, and destiny demanding situations, offering insights into key components for destiny learn and development. 

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3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics) by Yan Li,Deepak Goyal


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